Temperature Probes
E302, E306 and E312 monitors can support up to 2, 6 and 12 temperature probes respectively.
Temperature probes consist of a small epoxy-coated thermistor at the end of a light-gauge wire. Each probe includes a Molex connector that can be inserted into any of the probe receptacles.
Probe Lengths and Kits
Probes are available in 1 to 4 meter lengths. If a longer probe lead length is required extension cables can be added to the probe to accommodate the required length.
Individual Temperature Probes | Probe Extenders | ||
|---|---|---|---|
Model | Length | Model | Length |
TPP3-001M | 1m | TPP-X02M | 2m extension cable |
TPP3-002M | 2m | TPP-X04M | 4m extension cable |
TPP3-003M | 3m | TPP-X09M | 9m extension cable |
TPP3-004M | 4m | ||
Probes for E306 and E312 monitors are also available as kits that allow one monitoring device to monitor the temperature of up to six server cabinets. Probe placement will vary, according to rack sizes, and specific installation.
Pre-bundled Temperature Probe Assemblies
Model | Probes per rack | Racks per monitor | Total probes | Probe lengths | Use with Monitor |
|---|---|---|---|---|---|
TP03-01X6 | 1 | 6 | 6 | 1 x 3m. 4 x 4m. 1 x 5m | E306 |
TP03-02X3 | 2 | 3 | 6 | 2m. 3 x 3m. 2 x 4m | E306 |
TP03-03X2 | 3 | 2 | 6 | 1m. 2x2m, 2 x 3m. 1 x 4m | E306 |
TP03-06X1 | 6 | 1 | 6 | 1m. 2 x 2m, 2 x 3m | E306 |
TP03-06X2 | 6 | 2 | 12 | 1m. x 2m. 3 x 3m. 2 x 4m | E312 |
TP03-04X3 | 4 | 3 | 12 | 2x 1m. 4x2m 2 x 3m, 4 x 4m | E312 |
TP03-03X4 | 3 | 4 | 12 | 1 x 1m,3 x 2m. 4 x 3m. 4 x 4m | E312 |
TP03-02X6 | 2 | 6 | 12 | 1 x 1m. 2 x 2m. 4 x 3m, 4 x 4m, 1 x 5m | E312 |
Temperature Probe Placement
Ideal temperature placement is a function of rack type, appliance type, air flow, and specific appliance location and density. As a general rule, temperature probes are placed on the cool (intake or front side) of the rack, and monitor the temperature of the input air flow. The intake air is monitored because it can be controlled, while the output or rear air flow is a function of the device heat generation, input air temperature, and input air flow. In high density applications, we recommended monitoring both input (front) and output (rear) air flow. This allows for identification of “hot spots” that may indicate devices are operating in excess of their thermal ratings.
